Precision Grinding and Polishing Machine With Vacuum Adsorbed, LAP-100U/200U

Name | Specification
Model | LAP-100U | LAP-200U
Number of polishing heads | 1 | 2
Sample diameter | 3 (option: 4 inch), can be used for grinding and polishing 3 (option: 4 inch) wafers | 5 (option: 6 inch), can be used for grinding and polishing 5 (option: 6 inch) wafers
Resolution of polishing amount | 1μm
Sample tilt angle | 0-10 degrees adjustable
Sample loading force | 0-4 kg continuously adjustable
Sample swing speed | Adjustable
Swing arm swing amplitude | 0-15 degrees adjustable
Diameter of polishing disc (mm) | φ300 | φ400
Motor power of polishing disc | 1KW
Speed ​​(r/min) | 5-1500
Direction of rotation | Counterclockwise/clockwise optional, automatic switching between forward and reverse
Four-speed manual (r/min) | V1=5, V2=15, V3=25, V4=50 (user-customizable speed)
Automatic grinding and polishing parameters | 64 types (parameters include: speed, time and grinding disc rotation direction)
Grinding and polishing parameters | Users can set and call
Number of dripper units | 4 units
Dripping speed | 1-100 ml/min
Power supply | Voltage: AC220V, Frequency: 50HZ
Dimensions (mm) | 760 x 430 x 360 (length*width*height)
Weight | 30kg